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Ball grid array
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Keyword
keyword
Ball grid array
RIS
0.000
(Research Intensity Score)
Papers
75
Top papers
Interpretable data-driven framework for life prediction of homogenous lead-free solder joints in ball grid array packages
2025 · 12 citations
Analysis of BGA Lead-Free solder joints failure behavior based on thermal shock testing
2024 · 15 citations
Comparison of the Reliability of SAC305 and Innolot-Based Solder Alloy in a Board-Level BGA Package Considering Harmonic and Random Vibration Environment
2025 · 11 citations
Three-Dimensional SIP Design of the Four-Channel RF Transceiver Based on Silicon and ALN for X -Band Radar Applications
2023 · 30 citations
Current Advances and Outlook of Advanced Packaging
2025 · 6 citations
Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi Solder Joints After Thermal Cycling
2025 · 9 citations
AgIn2 thickness on void rate, microstructure, IMC growth, thermal and mechanical properties of fluxless In@AgIn2 joint
2025 · 9 citations
Effects of bismuth on the microstructure and crack propagation in Sn–Ag–Cu-Bi solder joints during thermal cycling
2025 · 4 citations
Leveraging Modularity of Chiplets to Form a 4×4 Automotive FMCW-Radar in an eWLB-Package
2025 · 4 citations
Newest papers
Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints
2026 · 1 citations
Enhanced Adhesion Strength of Copper/Epoxy Composite Build-Up Films for Flip-Chip Ball Grid Array Substrates via Interfacial Chemical Modification
2026
IMC Growth Mechanisms of SAC305 Lead-Free Solder on Different Surface Finishes and Their Effects on Solder Joint Reliability of FCBGA Packages at Different Thermal Aging and Temperature Cycle Conditions
2026
Thermoelectric Device Packaging for High Reliability Aerospace Applications
2026
Temperature Rise Measurement due to Joule Heating in a Stamped Metal Land Grid Array Socket
2026
Interfacial Microstructure Evolution and High-Speed Ball Shear Fracture of SAC305/Cu-20wt%Zn Solder Joints Under Isothermal Aging
2026
Interpretable data-driven framework for life prediction of homogenous lead-free solder joints in ball grid array packages
2025 · 12 citations
Comparison of the Reliability of SAC305 and Innolot-Based Solder Alloy in a Board-Level BGA Package Considering Harmonic and Random Vibration Environment
2025 · 11 citations
Current Advances and Outlook of Advanced Packaging
2025 · 6 citations
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