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Direct bonding
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Keyword
keyword
Direct bonding
RIS
0.001
(Research Intensity Score)
Papers
220
Top papers
Ultrafast tunable lasers using lithium niobate integrated photonics
2023 · 280 citations
Nanocrystalline copper for direct copper-to-copper bonding with improved cross-interface formation at low thermal budget
2024 · 65 citations
Thermal-inert and ohmic-contact interface for high performance half-Heusler based thermoelectric generator
2022 · 86 citations
Copper Bonding Technology in Heterogeneous Integration
2023 · 71 citations
Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends
2025 · 15 citations
A kinetic model of copper-to-copper direct bonding under thermal compression
2021 · 99 citations
Investigation of bonding mechanism for low-temperature Cu Cu bonding with passivation layer
2022 · 74 citations
Boron in the Second Coordination Sphere of Fe Single Atom Boosts the Oxygen Reduction Reaction
2024 · 25 citations
Direct Wafer Bonding of Silicon Carbide and Copper
2025 · 12 citations
Newest papers
Bonding-driven self-optimization of heterobilayer-passivated Cu–Cu interfaces for 3D integration
2026
Optimization effect of intercolumnar nanoscale grains on (111) oriented nanotwinned copper direct bonding below 250 °C
2026
Electrically Reconfigurable Silicon Carbide Nanophotonic Cavities on Thin-Film Lithium Niobate
2026
Electrically Reconfigurable Silicon Carbide Nanophotonic Cavities on Thin-Film Lithium Niobate
2026
Two-Stage Electromigration Mechanism in Cu–Cu Direct Bonding Lines Revealed by In Situ Four-Dimensional Scanning Transmission Electron Microscopy
2026
Two-StageElectromigration Mechanism in Cu–CuDirect Bonding Lines Revealed by In Situ Four-Dimensional ScanningTransmission Electron Microscopy
2026
Low-Defect Bulk-Germanium-on-Insulator Photodetectors with Resonant Cavity Enhancement at 1550 nm for High-Resolution SWIR Imaging
2026 · 1 citations
Wafer Level Batch Fabrication of Silicon Microchannel Heat Sink and Electrical Through-Silicon Vias for 3D ICs
2026
A receiving tape etching scheme for high-yield bonding after direct laser mass transfer process of micro-LEDs
2026
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