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Electromigration
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Keyword
keyword
Electromigration
RIS
0.001
(Research Intensity Score)
Papers
160
Top papers
Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies
2023 · 105 citations
Breakdown of the Nernst–Einstein relation in carbon nanotube porins
2022 · 104 citations
Electromigration Failures in Integrated Circuits: A Review of Physics-Based Models and Analytical Methods
2025 · 17 citations
New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints
2020 · 245 citations
Thin film design of amorphous hafnium oxide nanocomposites enabling strong interfacial resistive switching uniformity
2023 · 38 citations
Dynamic growth mechanism of tin whisker driven by compressive stress under thermal-mechanic-electric-diffusion coupling
2023 · 36 citations
Reliability issues of lead-free solder joints in electronic devices
2019 · 228 citations
Influence of trace tungsten contents on thin-film properties and electromigration behaviors of electroless-deposited cobalt interconnect lines
2025 · 8 citations
Graphene-All-Around Cobalt Interconnect with a Back-End-of-Line Compatible Process
2024 · 21 citations
Newest papers
Multi-physics coupling model of chloride-induced rebar corrosion and concrete cracking in reinforced concrete structure
2026 · 2 citations
Real-Time TEM Observation of the Microstructural Evolution in Silver Nanowires under Heating and Electrical Biasing
2026 · 3 citations
Impact of DC current density on filling mechanism and microstructural evolution of metallization in TGV
2026 · 1 citations
Research progress on galvanic corrosion mechanisms and suppression strategies in Cu interconnect CMP processes for IC
2026 · 2 citations
Interface Barrier Technologies in Advanced Semiconductor Interconnect Metals and Their Reliability Impact: The Evolution from Cu to Co/Ru
2026
Temperature Rise Measurement due to Joule Heating in a Stamped Metal Land Grid Array Socket
2026
Atomic-scale mechanisms of electromigration resistance in thickness-dependent micro-bump interconnects
2026
Two-Stage Electromigration Mechanism in Cu–Cu Direct Bonding Lines Revealed by In Situ Four-Dimensional Scanning Transmission Electron Microscopy
2026
Two-StageElectromigration Mechanism in Cu–CuDirect Bonding Lines Revealed by In Situ Four-Dimensional ScanningTransmission Electron Microscopy
2026
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