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Flip chip
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Flip chip
RIS
0.001
(Research Intensity Score)
Papers
96
Top papers
Recent Advances in Device-Level Thermal Management Technologies for Wide Bandgap Semiconductor: A Review
2025 · 35 citations
Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology
2025 · 23 citations
Ultrahigh‐Efficiency Dual‐Band Thin‐Film Lithium Niobate Modulator Incorporating Low‐k Underfill for 390 Gbit s −1 PAM8 Transmission
2025 · 20 citations
Advanced Packaging Technology of GaN HEMT Module for High-Power and High-Frequency Applications: A Review
2024 · 23 citations
Systematic study of the effect of silane coupling agent on the hydrothermal aging resistance of the underfill epoxy resin and silica interface via molecular dynamics simulation
2025 · 15 citations
Highly efficient GaN-based high-power flip-chip light-emitting diodes
2019 · 266 citations
A review of lead-free solders for electronics applications
2017 · 510 citations
Design of Low Parasitic Inductance GaN HEMT Flip-Chip Power Module
2025 · 6 citations
Pathways for underfill materials in high density integration towards commercializable thermal performance
2026
Newest papers
Pathways for underfill materials in high density integration towards commercializable thermal performance
2026
IMC Growth Mechanisms of SAC305 Lead-Free Solder on Different Surface Finishes and Their Effects on Solder Joint Reliability of FCBGA Packages at Different Thermal Aging and Temperature Cycle Conditions
2026
Processing and Reliability Issues for Eutectic AuSn Solder Joints
2026
Rigid-flexible liquid metal interconnection via patterned in-situ indium doping
2026
Flip chip interconnects for quantum computing application: a comparison between tin-silver and indium bump
2026 · 1 citations
Thermosonic Gold to Gold Interconnect (GGI) Flip Chip Bonding for 7mm2 Die
2026
Evaluation of Electroless Nickel Electroless Palladium (ENEP) finish as a replacement for Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) for Gold Wirebonding and SAC305 Solderability
2026
Recent Advances in Device-Level Thermal Management Technologies for Wide Bandgap Semiconductor: A Review
2025 · 35 citations
Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology
2025 · 23 citations
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