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Flip chip
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Current data, viewed at
Yearly
resolution.
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Application
keyword
Flip chip
RIS
0.000
(Research Intensity Score)
Papers
74
Top papers
Recent Advances in Device-Level Thermal Management Technologies for Wide Bandgap Semiconductor: A Review
2025 · 35 citations
Ultrahigh‐Efficiency Dual‐Band Thin‐Film Lithium Niobate Modulator Incorporating Low‐k Underfill for 390 Gbit s −1 PAM8 Transmission
2025 · 27 citations
Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology
2025 · 24 citations
Highly efficient GaN-based high-power flip-chip light-emitting diodes
2019 · 272 citations
Advanced Packaging Technology of GaN HEMT Module for High-Power and High-Frequency Applications: A Review
2024 · 23 citations
Newest papers
Flip chip interconnects for quantum computing application: a comparison between tin-silver and indium bump
2026 · 1 citations
Pathways for underfill materials in high density integration towards commercializable thermal performance
2026
IMC Growth Mechanisms of SAC305 Lead-Free Solder on Different Surface Finishes and Their Effects on Solder Joint Reliability of FCBGA Packages at Different Thermal Aging and Temperature Cycle Conditions
2026
Processing and Reliability Issues for Eutectic AuSn Solder Joints
2026
Rigid-flexible liquid metal interconnection via patterned in-situ indium doping
2026
A sample from the 74 top papers behind Flip chip.
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