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Interposer
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keyword
Interposer
RIS
0.001
(Research Intensity Score)
Papers
103
Top papers
Integrated silicon photonic MEMS
2023 · 142 citations
Thermal property evaluation of a 2.5D integration method with device level microchannel direct cooling for a high-power GaN HEMT device
2022 · 53 citations
Reliability Simulation Analysis of TSV Structure in Silicon Interposer under Temperature Cycling
2024 · 17 citations
Current Advances and Outlook of Advanced Packaging
2025 · 6 citations
O-band 32 × 32 silicon photonic switch with double Mach-Zehnder switch elements
2025 · 7 citations
Integrated Circuit-on-Glass (ICoG): A Self-Packaged 3D-Heterogeneous Integration (3DHI) Platform for Millimeter-Wave Circuits With Embedded GaN-on-Si Dielets
2025 · 4 citations
Zamin — PRATIK Ternary Silicon: physicalizing the poised-zero substrate
2026
High-power heterogeneously integrated mode-locked laser enabled by a booster amplifier
2025 · 2 citations
High Density MIMCAPs in a 300mm Silicon Interposer using High-k Dielectric and 3D Oxide-studs for mm-Wave Applications
2026
Newest papers
Zamin — PRATIK Ternary Silicon: physicalizing the poised-zero substrate
2026
High Density MIMCAPs in a 300mm Silicon Interposer using High-k Dielectric and 3D Oxide-studs for mm-Wave Applications
2026
Thermal analysis of 3D GPU-memory architectures with boron nitride interposer
2026 · 1 citations
Fine Trench Fabrication by Excimer Laser Ablation and Plasma Etching
2026
Current Advances and Outlook of Advanced Packaging
2025 · 6 citations
O-band 32 × 32 silicon photonic switch with double Mach-Zehnder switch elements
2025 · 7 citations
Integrated Circuit-on-Glass (ICoG): A Self-Packaged 3D-Heterogeneous Integration (3DHI) Platform for Millimeter-Wave Circuits With Embedded GaN-on-Si Dielets
2025 · 4 citations
High-power heterogeneously integrated mode-locked laser enabled by a booster amplifier
2025 · 2 citations
Reliability study and optimization of TSV interconnections with silicon interposer under random vibration
2025 · 3 citations
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