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Static random-access memory
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Keyword
keyword
Static random-access memory
RIS
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(Research Intensity Score)
Papers
71
Top papers
Progress of emerging non-volatile memory technologies in industry
2024 · 50 citations
3D Stacked FET (3DSFET) Logic and SRAM Technology Featuring Single Diffusion Break (SDB) and Back Side Interconnect (BSI) at 48 nm CPP for Advanced Mobile and High Performance Computing (HPC) Applications
2025 · 9 citations
3nm GAA Technology featuring Multi-Bridge-Channel FET for Low Power and High Performance Applications
2018 · 308 citations
High-density, nonvolatile SRAM using monolithic 3D integration of InGaZnO thin-film transistors and Hf0.5Zr0.5O2-based ferroelectric capacitors
2025 · 7 citations
First Demonstration of BEOL-Compatible Co-Sputter Deposited $\text{Te}_{1-x} \text{Se}_{x}$ p-FETs Enabling 3D Stackable Oxide Semiconductor CFET, DRAM, and First CFET-Structured SRAM
2025 · 6 citations
Low-Power and Scalable BEOL-Compatible IGZO TFT eDRAM-Based Charge-Domain Computing
2023 · 23 citations
Gain Cell Memory on Logic Platform – Device Guidelines for Oxide Semiconductor Transistor Materials Development
2023 · 20 citations
CFET Beyond 3 nm: SRAM Reliability Under Design-Time and Run-Time Variability
2025 · 8 citations
COFFEE: A Carbon-Modeling and Optimization Framework for HZO-based FeFET eNVMs
2026 · 1 citations
Newest papers
COFFEE: A Carbon-Modeling and Optimization Framework for HZO-based FeFET eNVMs
2026 · 1 citations
LatticeFET / BSP-Mesh N2: A Locality-First GAA, Backside-Power, and SRAM Compute Platform
2026
LatticeFET / BSP-Mesh N2: A Locality-First GAA, Backside-Power, and SRAM Compute Platform
2026
COFFEE: A Carbon-Modeling and Optimization Framework for HZO-based FeFET eNVMs
2026
3D Stacked FET (3DSFET) Logic and SRAM Technology Featuring Single Diffusion Break (SDB) and Back Side Interconnect (BSI) at 48 nm CPP for Advanced Mobile and High Performance Computing (HPC) Applications
2025 · 9 citations
High-density, nonvolatile SRAM using monolithic 3D integration of InGaZnO thin-film transistors and Hf0.5Zr0.5O2-based ferroelectric capacitors
2025 · 7 citations
First Demonstration of BEOL-Compatible Co-Sputter Deposited $\text{Te}_{1-x} \text{Se}_{x}$ p-FETs Enabling 3D Stackable Oxide Semiconductor CFET, DRAM, and First CFET-Structured SRAM
2025 · 6 citations
CFET Beyond 3 nm: SRAM Reliability Under Design-Time and Run-Time Variability
2025 · 8 citations
A monolithic 3D IGZO-RRAM-SRAM-integrated architecture for robust and efficient compute-in-memory enabling equivalent-ideal device metrics
2025 · 5 citations
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