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Thermocompression bonding
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Current data, viewed at
Yearly
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Keyword
keyword
Thermocompression bonding
RIS
0.000
(Research Intensity Score)
Papers
46
Top papers
Copper Bonding Technology in Heterogeneous Integration
2023 · 76 citations
Thermal Transport and Mechanical Stress Mapping of a Compression Bonded GaN/Diamond Interface for Vertical Power Devices
2024 · 42 citations
A kinetic model of copper-to-copper direct bonding under thermal compression
2021 · 109 citations
Investigation of bonding mechanism for low-temperature Cu Cu bonding with passivation layer
2022 · 74 citations
Unraveling diffusion behavior in Cu-to-Cu direct bonding with metal passivation layers
2024 · 26 citations
Newest papers
Comparative multiscale evaluation of the temperature-dependent interfacial strength in aluminum alloy/carbon fiber-reinforced thermoplastic joints
2026 · 3 citations
GaAs solar cell transfer onto copper substrates via thermocompression bonding for photovoltaic thermoelectric hybridization
2026 · 1 citations
Interface-engineered oxidation-resistant wafer-level Tantalum-Tantalum thermocompression bonding for 3D integration of superconducting interconnects
2026
Interface-engineered oxidation-resistant wafer-level Tantalum-Tantalum thermocompression bonding for 3D integration of superconducting interconnects
2026
Fast Cu-Cu pillar array bonding by thermally stable nanocrystalline Cu
2026
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