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Wafer bonding
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Keyword
keyword
Wafer bonding
RIS
0.001
(Research Intensity Score)
Papers
109
Top papers
Copper Bonding Technology in Heterogeneous Integration
2023 · 71 citations
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
2021 · 211 citations
Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends
2025 · 15 citations
Wafer-scale low-loss lithium niobate photonic integrated circuits
2020 · 194 citations
Heterogeneous integration of III–V semiconductor lasers on thin-film lithium niobite platform by wafer bonding
2023 · 48 citations
Ga 2 O 3 -on-SiC Composite Wafer for Thermal Management of Ultrawide Bandgap Electronics
2021 · 102 citations
Heterogeneous wafer bonding of ultra-wide bandgap Ga2O3: A review
2024 · 18 citations
Direct Wafer Bonding of Silicon Carbide and Copper
2025 · 12 citations
Wafer‐scale integration of photonic integrated circuits and atomic vapor cells
2025 · 7 citations
Newest papers
Interface-engineered oxidation-resistant wafer-level Tantalum-Tantalum thermocompression bonding for 3D integration of superconducting interconnects
2026
Interface-engineered oxidation-resistant wafer-level Tantalum-Tantalum thermocompression bonding for 3D integration of superconducting interconnects
2026
Xenon vs Argon Ion Activation for Room-Temperature Wafer Bonding of Si and SiC
2026
Direct Bonding of 6-inch GaAs/SiC Wafers for Enhanced Thermal Management in High-Power Devices
2026 · 1 citations
Room Temperature Direct Bonding of Lithium Niobate Wafers With Different Orientations
2026
Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends
2025 · 15 citations
Direct Wafer Bonding of Silicon Carbide and Copper
2025 · 12 citations
Wafer‐scale integration of photonic integrated circuits and atomic vapor cells
2025 · 7 citations
Fabrication of High-Resolution Active Matrix Micro-LED Display Based on Direct Laser Mass Transfer
2025 · 5 citations
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