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Wafer bonding
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Current data, viewed at
Yearly
resolution.
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Keyword
keyword
Wafer bonding
RIS
0.002
(Research Intensity Score)
Papers
244
Top papers
Copper Bonding Technology in Heterogeneous Integration
2023 · 76 citations
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
2021 · 213 citations
Wafer-scale low-loss lithium niobate photonic integrated circuits
2020 · 198 citations
Gallium oxide (Ga2O3) heterogeneous and heterojunction power devices
2023 · 41 citations
Ga 2 O 3 -on-SiC Composite Wafer for Thermal Management of Ultrawide Bandgap Electronics
2021 · 105 citations
Newest papers
Heterogeneous Back‐End‐of‐Line Integration of Thin‐Film Lithium Niobate on Active Silicon Photonics for Single‐Chip Optical Transceivers
2026 · 3 citations
SH-SAW Acousto-Electric Amplifier in Epitaxial InGaAs on Lithium Niobate on Insulator
2026
SH-SAW Acousto-Electric Amplifier in Epitaxial InGaAs on Lithium Niobate on Insulator
2026
Direct Bonding of 6-inch GaAs/SiC Wafers for Enhanced Thermal Management in High-Power Devices
2026 · 1 citations
Strain-Engineered Wavelength Tuning in Flexible InGaN/GaN MQW LEDs via High-Modulus Tungsten Substrates
2026
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