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Wafer dicing
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Current data, viewed at
Yearly
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Keyword
keyword
Wafer dicing
RIS
0.000
(Research Intensity Score)
Papers
61
Top papers
A State-of-the-Art Review of Fracture Toughness of Silicon Carbide: Implications for High-Precision Laser Dicing Techniques
2024 · 30 citations
Electrical discharge machining of semiconductor materials: A review
2023 · 45 citations
Slicing of 4H‐SiC Wafers Combining Ultrafast Laser Irradiation and Bandgap‐Selective Photo‐Electrochemical Exfoliation
2023 · 39 citations
Modulation of ultrafast laser-induced modified structure inside silicon carbide for thin wafer dicing
2024 · 22 citations
The internal modified layer structure of silicon carbide induced by ultrafast laser and its application in stealth dicing
2024 · 22 citations
Newest papers
Review on silicon carbide cutting technology
2026 · 1 citations
Flow-field-coupled thickness prediction and process optimization of diamond–nickel composite electroformed coatings for ultra-thin dicing blades
2026
A Comparison of Plasma and Mechanical Dicing of Indium Phosphide
2026
Laser stealth dicing of β-Ga2O3: Theoretical and experimental studies
2025 · 9 citations
Laser ablation and stealth dicing of full-thickness silicon wafer
2025 · 7 citations
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