elements
-live
Search elements, keywords, and sectors
🔎
Elements
Subjects
Pricing
Log in
Sign up
Home
/
Subjects
/
Wafer dicing
← Back to subjects
Current data, viewed at
Yearly
resolution.
Personal members see monthly resolution →
Keyword
keyword
Wafer dicing
RIS
0.000
(Research Intensity Score)
Papers
57
Top papers
A State-of-the-Art Review of Fracture Toughness of Silicon Carbide: Implications for High-Precision Laser Dicing Techniques
2024 · 25 citations
Electrical discharge machining of semiconductor materials: A review
2023 · 44 citations
Modulation of ultrafast laser-induced modified structure inside silicon carbide for thin wafer dicing
2024 · 21 citations
Slicing of 4H‐SiC Wafers Combining Ultrafast Laser Irradiation and Bandgap‐Selective Photo‐Electrochemical Exfoliation
2023 · 39 citations
The internal modified layer structure of silicon carbide induced by ultrafast laser and its application in stealth dicing
2024 · 22 citations
Laser stealth dicing of β-Ga2O3: Theoretical and experimental studies
2025 · 9 citations
Laser Processing Methods in Precision Silicon Carbide Wafer Exfoliation: A Review
2025 · 3 citations
Flow-field-coupled thickness prediction and process optimization of diamond–nickel composite electroformed coatings for ultra-thin dicing blades
2026
Laser ablation and stealth dicing of full-thickness silicon wafer
2025 · 7 citations
Newest papers
Flow-field-coupled thickness prediction and process optimization of diamond–nickel composite electroformed coatings for ultra-thin dicing blades
2026
Review on silicon carbide cutting technology
2026 · 1 citations
A Comparison of Plasma and Mechanical Dicing of Indium Phosphide
2026
Laser stealth dicing of β-Ga2O3: Theoretical and experimental studies
2025 · 9 citations
Laser Processing Methods in Precision Silicon Carbide Wafer Exfoliation: A Review
2025 · 3 citations
Laser ablation and stealth dicing of full-thickness silicon wafer
2025 · 7 citations
Optimized for Silicon Wafer Dicing Blade Machining and Grinding Parameters of Structure
2025 · 4 citations
Investigation of the bonding performance of PZT with different adhesive systems
2025 · 1 citations
Spectroscopic characterization of Pr,Zn:LT and Pr,Zr:LT ridge waveguides, fabricated by high temperature in-diffusion and diamond-blade dicing
2025
Browse all papers →
Wafer dicing's history
Research intensity over time
Yearly
Personal members see monthly resolution →
Data temporarily unavailable — please try again shortly.
Close ✕
Wafer dicing's papers
Ordered by current research-activity contribution.
Loading…
Close ✕
Read full text ↗
Share
Share on X
Share on Facebook
Share on LinkedIn
Copy link