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Anodic bonding
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Current data, viewed at
Yearly
resolution.
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Keyword
keyword
Anodic bonding
RIS
0.001
(Research Intensity Score)
Papers
113
Top papers
Copper Bonding Technology in Heterogeneous Integration
2023 · 76 citations
A kinetic model of copper-to-copper direct bonding under thermal compression
2021 · 109 citations
Investigation of bonding mechanism for low-temperature Cu Cu bonding with passivation layer
2022 · 74 citations
Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends
2025 · 16 citations
An easy-to-prepare flexible 3D network aqueous binder with gradient hydrogen bonding for high-performance silicon anodes
2024 · 26 citations
Newest papers
Enabling atom-clad waveguide operation in a microfabricated alkali vapor–photonic integrated circuit
2026 · 3 citations
Enhancing Cu-Cu Stitch Bonding Reliability on Cu Leadframe Through Ultrathin Cu-Selective Passivation
2026 · 1 citations
Interface-engineered oxidation-resistant wafer-level Tantalum-Tantalum thermocompression bonding for 3D integration of superconducting interconnects
2026
Interface-engineered oxidation-resistant wafer-level Tantalum-Tantalum thermocompression bonding for 3D integration of superconducting interconnects
2026
Impact of Bonding Temperature on the Interfacial Stability and Degradation Mechanisms of Perovskite Solar Cells
2026
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