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Wire bonding
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Current data, viewed at
Yearly
resolution.
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Keyword
keyword
Wire bonding
RIS
0.001
(Research Intensity Score)
Papers
110
Top papers
Copper Bonding Technology in Heterogeneous Integration
2023 · 76 citations
High-power and narrow-linewidth laser on thin-film lithium niobate enabled by photonic wire bonding
2025 · 29 citations
Review of Topside Interconnections for Wide Bandgap Power Semiconductor Packaging
2022 · 72 citations
Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography
2020 · 177 citations
State-of-the-art of the bond wire failure mechanism and power cycling lifetime in power electronics
2023 · 41 citations
Newest papers
Enhancing Cu-Cu Stitch Bonding Reliability on Cu Leadframe Through Ultrathin Cu-Selective Passivation
2026 · 1 citations
Online Condition Monitoring of Bond Wire Lift-Off in SiC MOSFETs Using Discrete Transmission Line Response to Gate Resistor Voltage
2026
Towards Reliable and Scalable Point-of-Care Diagnostic Platforms
2026
Thermosonic Gold to Gold Interconnect (GGI) Flip Chip Bonding for 7mm2 Die
2026
Improved Bond Strength in Au Wire Bonding Through Process Parameter Optimization and Argon Plasma Cleaning
2026
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